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FUSB301ATMX датащи(PDF) 3 Page - ON Semiconductor |
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FUSB301ATMX датащи(HTML) 3 Page - ON Semiconductor |
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3 / 14 page ![]() FUSB301A www.onsemi.com 3 PIN DESCRIPTIONS Pin # Name Type Description USB Type−C Connector Interface 1, 2 CC1, CC2 I/O Type−C Configuration Channel 4 VBUS Input VBUS input pin for attach and detach detection 10 GND Ground Ground Power Interface 12 VDD Power Input Supply Voltage Signal Interface 8 SCL Input I2C serial clock signal to be connected to the I2C master 7 SDA Open−Drain I/O I2C serial data signal to be connected to the I2C master 6 INT_N Open−Drain Output Active LOW open drain interrupt output used to prompt the processor to read the I2C register bits 9 ID Open−Drain Output Used to Identify if connected device is Source or Sink. The ID Pin can be used to interface with USB 2.0 Input on the processor. 5 I2CADDR Input Used to change bit 3 of the I2C address so that multiple addresses can be used in a system where two device addresses conflict 3 NC1 NC No Connect − Tie to Ground or Float 11 NC2 NC No Connect − Tie to Ground or Float Dead Battery If power is not applied to FUSB301A and it is attached to a Source device, then the Source would pull up the CC line connected through the cable. The FUSB301A in response would turn on the pull−down that will bring the CC voltage to a range that the Source can detect an attach and turn on VBUS. Power Up, Initialization and Reset, Interrupt Operation When power is first applied, the FUSB301A will power up in Sink mode with all interrupts masked. The local processor must configure the FUSB301A to the desired mode and clear the global interrupt mask bit, INT_MASK. The INT_N pin is an active low, open drain output. This pin indicates to the host processor that an interrupt has occurred in the FUSB301A which needs attention. The INT_N pin is in a high impedance state by default after power−up or device reset, and the global interrupt mask (INT_MASK in Control register) is set. After INT_MASK bit is cleared by the local processor, the INT_N pin stays high impedance in preparation of future interrupts. When an interruptible event occurs, INT_N is driven LOW and is in a high impedance state again when the processor clears the interrupt by reading the interrupt registers. Subsequent to the initial power up or reset; if the processor writes a “1” to global interrupt mask bit when the system is already powered up, the INT_N pin stays in a high impedance state and ignores all interrupts until the global interrupt mask bit is cleared. If an event happens that would ordinarily cause an interrupt when the global interrupt mask bit is set, the INT_N pin goes LOW when the global interrupt mask is cleared. Table 1. ID PIN TRUTH TABLE Type Register (h12, bit 4) Description ID SINK = b0 SINK Not Detected Hi−Z (default) SINK = b1 SINK Detected Low ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min. Max. Unit VDD Supply Voltage from VDD −0.5 6.0 V VBUS VBUS Supply Voltage −0.5 28 V VCC_HDDRP CC pins when configured as Host, Device or Dual Role Port −0.5 6.0 V TSTORAGE Storage Temperature Range −65 +150 °C |
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