10

FH33 Series

■Recommended Temperature Profile

MAX 250ç

Start

(ç)

Time (Seconds)

25ç

(60 sec.)

(60 sec.)

90 to 120 sec.

Preheating

Sodering

0

50

100

150

150ç

200ç

230ç

200

250

HRS test conditions

Solder method : Reflow, IR/hot air

Environment

: Room air

Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.’s Part Number: M705-

221CM5-32-10.5)

Test board

: Glass epoxy 25mm∞50mm∞0.8mm thick

Land dimensions : Contacts lead 0.3mm∞0.65mm

Metal fittings 0.55mm∞0.8mm

Metal mask

: Contacts lead 0.25mm∞0.65mm∞0.1mm

thick

Metal fittings 0.55mm∞0.8mm∞0.1mm

thick

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and

board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.