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NLAS3157 датащи(PDF) 2 Page - ON Semiconductor |
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NLAS3157 датащи(HTML) 2 Page - ON Semiconductor |
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2 / 7 page ![]() NLAS3157, NLAS3257 www.onsemi.com 2 Table 1. MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage −0.5 to +5.5 V VIN Control Input Voltage (S Pin) −0.5 to +5.5 V VIS Switch Input / Output Voltage (A, BO, B1 Pins) −0.5 to VCC + 0.5 V IIK Control DC Input Diode Current (S Pin) VIN < GND −50 mA IOK Switch I/O Port DC Diode Current (A, BO, B1 Pins) VI/O < GND or VI/O > VCC ±50 mA IO On−State Switch Current ±128 mA Continuous Current Through VCC or GND ±150 mA ICC DC Supply Current per Supply Pin ±150 mA IGND DC Ground Current per Ground Pin ±150 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C qJA Thermal Resistance (Note 1) 407 °C/W PD Power Dissipation in Still Air at 85 °C (Note 1) 1.5 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Mode (Note 2) Machine Mode (Note 3) Charged Device Mode (Note 4) >8000 >300 >2000 V ILATCHUP Latchup Performance Above VCC and Below GND at 85°C (Note 5) ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow . 2. Tested to EIA/ JESD22−A114−A 3. Tested to EIA/ JESD22−A115−A 4. Tested to JESD22−C101−A 5. Tested to EIA / JESD78 Table 2. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Positive DC Supply Voltage 1.65 4.5 V VI Control Input Voltage (S Pin) 0 4.5 V VIS Switch Input / Output Voltage (A, BO, B1 Pins) 0 VCC V TA Operating Free−Air Temperature −40 +85 °C Dt / DV Input Transition Rise or Fall Rate Control Input Switch I/O 0 0 5 DC ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. |
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