Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.

© 2016 Freescale Semiconductor, Inc. All rights reserved.

SCM-i.MX 6Dual/6Quad Datasheet

for Consumer Products

1. Introduction

Freescale Single Chip System Modules (SCMs) are a

suite of highly integrated products in an ultra-small

form factor. The first member of this portfolio, the

Freescale SCM-i.MX 6Dual/6Quad, drastically reduces

time to market by providing a solution that minimizes

design time. We’ve integrated and validated dual- and

quad-core performance, the power management system,

flash memory, and over a hundred passive system

components all in the size of a dime. The SCM-i.MX

6Dual/6Quad is enabled with the standard i.MX

6Dual/6Quad multimedia, connectivity and security

features including High Assurance Boot, cryptographic

cipher engines, random number generator, and tamper

detection. It is a scalable solution intended for use in a

wide variety of consumer and industrial applications.

The SCM-i.MX 6Dual/6Quad speeds and eases

development time by addressing technology challenges

such as design of DDR and power management. Our

single chip module i.MX 6Dual/6Quad consists of the

i.MX 6Dual/6Quad applications processor, PF0100

(PMIC) for power management, 16 MB SPI NOR, over

a hundred discrete components, and is enabled for 1 or 2

GB LPDDR2 via PoP assembly.

Freescale Semiconductor, Inc.

Document Number: SCMIMX6DQ

Data Sheet: Technical Data

Rev. 0, 02/2016

Contents

1.

Introduction........................................................................ 1

1.1.

Ordering information .............................................. 2

1.2.

Features................................................................... 3

1.3.

References............................................................... 8

2.

Architectural Overview...................................................... 9

2.1.

Block Diagram........................................................ 9

3.

Modules List .................................................................... 10

3.1.

Special Signal Considerations............................... 10

4.

Electrical Characteristics.................................................. 11

4.1.

Chip-Level Conditions.......................................... 11

5.

Power Supplies Requirements and Restrictions ............... 12

5.1.

Power-Up Sequences ............................................ 12

5.2.

Power-Down Sequences ....................................... 12

5.3.

Power Supplies Usage........................................... 12

5.4.

Boot Configuration ............................................... 12

6.

Boot Mode Configuration ................................................ 14

6.1.

Boot Mode Configuration Pins ............................. 14

6.2.

Boot Devices Interfaces Allocation ...................... 14

7.

Package Information ........................................................ 15

7.1.

Signal List............................................................. 15

7.2.

Critical Signals...................................................... 22

7.3.

Ball Map ............................................................... 25

7.4.

Package Drawings................................................. 27

8.

Revision History .............................................................. 29