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ACPL-P302 датащи(PDF) 5 Page - Broadcom Corporation.

номер детали ACPL-P302
подробное описание детали  0.4-Amp Output Current IGBT Gate Driver Optocouplers
PDF  15 Pages
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производитель  BOARDCOM [Broadcom Corporation.]
домашняя страница  http://www.broadcom.com
Logo BOARDCOM - Broadcom Corporation.

ACPL-P302 датащи(HTML) 5 Page - Broadcom Corporation.

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Broadcom Confidential
- 5 -
ACPL-P302/ACPL-W302
Data Sheet
Insulation and Safety Related Specifications
Parameter
Symbol
ACPL-
P302
ACPL-
W302
Unit
Conditions
Minimum External Air Gap
(External Clearance)
L(101)
7.0
8.0
mm
Measured from input terminals to output terminals, shortest
distance through air.
Minimum External Tracking
(External Creepage)
L(102)
8.0
8.0
mm
Measured from input terminals to output terminals, shortest
distance path along body.
Minimum Internal Plastic
Gap (Internal Clearance)
0.08
0.08
mm
Through insulation distance conductor to conductor, usually
the straight line distance thickness between the emitter and
detector.
Minimum Internal Tracking
(Internal Creepage)
N/A
N/A
mm
Measured from input terminals to output terminals, along
internal cavity.
Tracking Resistance
(Comparative Tracking
Index)
CTI
>175
>175
V
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Note: All Broadcom data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point
for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage
and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a
printed circuit board between the solder fillets of the input and output leads must be considered (the recommended Land Pattern does not necessarily meet
the minimum creepage of the device). There are recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve
desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Unit
Note
Storage Temperature
TS
–55
+125
°C
Operating Temperature
TA
–40
+100
°C
Average Input Current
IF(AVG)
25
mA
1
Peak Transient Input Current
(<1 µs pulse width, 300pps)
IF(TRAN)
1.0
A
Reverse Input Voltage
VR
5
V
High Peak Output Current
IOH(PEAK)
0.4
A
2
Low Peak Output Current
IOL(PEAK)
0.4
A
2
Supply Voltage
VCC – VEE
–0.5
35
V
Output Voltage
VO(PEAK)
–0.5
VCC
V
Output Power Dissipation
PO
250
mW
3
Input Power Dissipation
PI
45
mW
4
Lead Solder Temperature
260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Package Outline Drawings section
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Unit
Note
Power Supply
VCC – VEE
10
30
V
Input Current (ON)
IF(ON)
7
12
mA
Input Voltage (OFF)
VF(OFF)
–3.6
0.8
V
Operating Temperature
TA
–40
100
°C



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