5

TMUX1072

www.ti.com

SCDS382 – APRIL 2018

Product Folder Links: TMUX1072

Submit Documentation Feedback

Copyright © 2018, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TMUX1072

UNIT

RUT (UQFN)

DGS (VSSOP)

12 PINS

10 PINS

Junction-to-ambient thermal resistance

127

175

°C/W

Junction-to-case (top) thermal resistance

55.5

61.2

°C/W

Junction-to-board thermal resistance

67.7

96.9

°C/W

Junction-to-top characterization parameter

1.6

8.2

°C/W

Junction-to-board characterization parameter

67.3

95.1

°C/W

6.5 Electrical Characteristics

noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY

Power supply voltage

2.3

5.5

V

Active supply current

OE = 0 V

75

100

µA

Supply current during OVP condition

OE = 0 V

65

100

µA

Standby powered down supply

current

SEL1 = 0 V, 1.8 V, or VCC

SEL2 = 0 V, 1.8 V, or VCC

3

10

µA

DC Characteristics

ON-state resistance

Refer to ON-State Resistance Figure

6

15

Ω

ON-state resistance match between

channels

Refer to ON-State Resistance Figure

0.07

0.3

Ω

ON-state resistance flatness

Refer to ON-State Resistance Figure

2.5

6

Ω

I/O pin OFF leakage current

Refer to Off Leakage Figure

3.6

µA

Refer to Off Leakage Figure

165

µA

ON leakage current

Refer to On Leakage Figure

1.2

µA

Digital Characteristics

Input logic high

SEL1, SEL2, OE

1.4

V

Input logic low

SEL1, SEL2, OE

0.5

V

Output logic low

FLT

0.4

V

Input high leakage current

-1

2

5

μA

Input low leakage current

SEL1, SEL2, OE = 0 V

-1

±0.2

5

μA