20

Low-profile Rotary Backlock Type (0.5 mm-pitch)

XF2N

Low-profile Rotary Backlock Type (0.5 mm-pitch)

XF2N

Greater Freedom of Board Design with

0.9-mm Profile and Bottom Wall

• Backlock mechanism makes FPC mounting significantly easier.

• Double-sided (upper and lower) contact structure enables

component reductions.

• Applicable FPC thickness, t = 0.2 mm. Gold-plated type.

• Use FPCs with the construction recommended by OMRON.

(Refer to specifications for details.)

• RoHS Compliant.

Ordering Information

Note: 1. Consult your OMRON representative for enquiries related to pin-number specifications.

2. Order an integer multiple of the quantity per reel.

Specifications

I Materials/Finish

Pins (Note 1)

Quantity per reel (Note 2)

Model

21

3,000

XF2N-2115-3

32

XF2N-3215-3

Rated current

0.3A AC/DC

Rated voltage

50V AC/DC

Contact resistance

40 m

Ω max. (at 20 mV max., 100 mA max.)

Insulation resistance

100 M

Ω min. (at 250 V DC)

Withstand voltage

250V AC for 1 min. (leakage current: 1 mA max.)

Insertion tolerance

20 times

Ambient operating temperature -30 to +85°C (with no icing or condensation)

Housing

LCP resin (UL94V-0)/natural

Slider

LCP resin (UL94V-0)/black

Contact

Spring copper alloy/nickel substrate (1.5

µm), gold-plated contacts (0.15µm)

Hold-down

Spring copper alloy/fused-tin plating (1.5

µm)

☞

Not Recommended for

New Designs