20

LED Control IC

W2RG012RN

Precautions for Use

■ Correct Use

• The absolute maximum rating is the limit value which should not be

exceeded even momentarily. Exceeding this value can cause dete-

rioration of the characteristics or complete failure of the IC.

• Check the operation at the communication frequency to be used

before using the device.

• Sufficiently take into consideration the static electricity, chattering

and voltage of the input to be connected when determining each

input circuit.

• Although the device contains an ESD protection circuit, static elec-

tricity that exceeds the function may damage the device. When

handling the device, exercise due caution by, for example, ground-

ing the body of the handler.

• Execute thermal design providing for a sufficient margin, by consid-

ering allowable dissipation in the actual operating condition. If a

high voltage is applied to IC (e.g. due to a small number of driven

series LEDs), heating of the IC can be controlled by inserting a

resistance to disperse power dissipation.

• A thermal shutdown circuit is built in this IC. If chip temperature has

risen abnormally, this circuit works to open output terminals. The

original condition is restored when chip temperature has decreased

to a normal level. As this circuit is provided as protection in the

event of emergency, do not use it on a regular basis.

• Due to potential damage, do not use product that has been

dropped or that has come into contact with water.

■ Cautions on Mounting

Mounting on a Flexible Substrate

When mounting the product on a flexible substrate, a reed may be

detached after mounting due to stress transmitted through the sub-

strate. Therefore, it is recommended to use, for mounting, a rein-

forced substrate or an underfill, etc.

Reworking with a Soldering Iron

The user is strictly admonished against the use of soldering iron for

rework. Such a use may cause mold cracking or open terminals.

■ Recommended Reflow

Conditions

Allowable Temperature Profile Conditions

Product mounting method should be by Reflow and we recommend

the following temperature profile. Reflow no more than twice.

Storage Conditions before Mounting

Moisture absorption by the plastic package will increase the possibil-

ity of faults, such as cracks; therefore, take enough care for storage.

Recommended Drying Conditions

If the allowable storage period after opening a moisture-proof package

has been exceeded, dry the products under the following conditions

before mounting them:

■ RoHS Directive Compliance

Models that are indicated as being RoHS compliant do not exceed

the threshold value for the following six substances.

Lead:

1,000 ppm max.

Mercury:

1,000 ppm max.

Cadmium:

100 ppm max.

Hexavalent chromium:

1,000 ppm max.

PBB:

1,000 ppm max.

PBDE:

1,000 ppm max.

■ Lot Code Indication

Flexible substrate

Underfill

Reinforcing plate

Storage Conditions

Period

Before moisture-proof

package is opened

5 to 30°C, 40 to 70%RH

1 Year

After moisture-proof

package is opened

5 to 30°C, 40 to 70%RH

168 hours

Temperature

Time

Frequency

60°C

72 hours

Once or twice

Time

10s (max)

250°C

260°C (max)

60~120s

140°C

200°C

220°C

60s (max)

Control Code: Three

alphanumeric characters

Production year: The last

digit of the calendar year

Production week: Serial numbers

(01~) from the week including

January1