NCV47722

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13

PACKAGE DIMENSIONS

SOIC−8 EP

CASE 751AC

ISSUE B

(In Development)

H

C

0.10

D

E1

A

D

PIN ONE

2 X

8 X

SEATING

PLANE

EXPOSED

GAUGE

PLANE

14

5

8

D

C

0.10

A-B

2 X

E

B

e

C

0.10

2 X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

DETAIL A

END VIEW

SECTION A−A

8 X

b

A-B

0.25

D

C

C

C

0.10

C

0.20

A

A2

G

F

1

4

58

NOTES:

1. DIMENSIONS AND TOLERANCING PER

ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS (ANGLES

IN DEGREES).

3. DIMENSION b DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE

0.08 MM TOTAL IN EXCESS OF THE “b”

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

4. DATUMS A AND B TO BE DETERMINED

AT DATUM PLANE H.

DIM

MIN

MAX

MILLIMETERS

A

1.35

1.75

A1

0.00

0.10

A2

1.35

1.65

b

0.31

0.51

b1

0.28

0.48

c

0.17

0.25

c1

0.17

0.23

D

4.90 BSC

E

6.00 BSC

e

1.27 BSC

L

0.40

1.27

L1

1.04 REF

F

2.24

3.20

G

1.55

2.51

h

0.25

0.50

q

0

8

h

AA

DETAIL A

(b)

b1

c

c1

0.25

L

(L1)

q

PAD

E1

3.90 BSC

_

_

A1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

LOCATION

Exposed

Pad

1.52

0.060

2.03

0.08

0.6

0.024

1.270

0.050

4.0

0.155

mm

inches

SCALE 6:1

7.0

0.275

2.72

0.107