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71

M25SI

Vishay Draloric

Document Number 20031

Revision 05-Aug-02

For Technical Questions, contact: ff2aresistors@vishay.com

Thin Film, Rectangular, Fusible, Resistor Chips

SIZE

DIMENSIONS in millimeters

INCH METRIC

L

W

H

T1

T2

1206

3216

3.2

1.6

± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2

+ 0.10

– 0.20

DIMENSIONS

SIZE

SOLDER PAD DIMENSIONS in millimeters*

INCH METRIC

a

b

l

a

b

l

1206

3216

0.9

1.7

2.0

1.1

1.7

2.3

120

100

80

60

40

20

0

- 55

-25

0

25

50

75

100

125

150 175

Ambient Temperature in

70

APPLICABLE SPECIFICATIONS

*Pads: recommendations only

• CECC40000 / 40400

• EN140400 / IEC 60115 – 1

Derating

100

75

60

45

30

15

0

0

0.1

0.2

0.3

0.4

Power in Watt

Temperature Rise

PERFORMANCE

TEST

CONDITIONS OF TEST

Endurance Test at 70

°C

1000 hours at 70

°C 1.5 hours “ON”, 0.5 hours “OFF”

≤ ± 1%

IEC 60115-1 4.25.1

Endurance at UCT

1000 hours at 125

°C without load

≤ ± 1%

IEC 60115-1 4.25.3

Thermal Shock

Rapid change between upper and lower

≤ ± 0.2%

IEC 60115-1 4.19, IEC 60068-2-14

category temperature

Damp Heat Steady State

56 days at 40

°C and 93% relative humidity

≤ ± 0.5%

IEC 60115-1 4.24, IEC 60068-2-3

Resistance to Soldering Heat

10 seconds at 260

°C solder bath temperature

≤ ± 0.2%

IEC 60115-1 4.18, IEC 60068-2-20