Broadcom

- 8 -

HSMR-C170-R0000

Data Sheet

Soldering

Figure 8 Recommended Reflow Soldering Condition



Do not perform reflow soldering more than twice. Observe

necessary precautions when handling moisture-sensitive

device as stated in the next section.



Do not apply any pressure or force on the LED during

reflow and after reflow while the LED is still hot.



Use reflow soldering to solder the LED. But if it is

unavoidable (such as rework), manual hand soldering may

be used but must be strictly controlled to the following

conditions:

—

Soldering iron tip temperature = 310°C max.

—

Soldering duration = 2s max.

—

Number of cycles = One only

—

Power of the soldering iron = 50W max.



Do not touch the LED package body with the soldering

iron except for the soldering terminals as it might damage

the LED.



Confirm beforehand whether the functionality and

performance of the LED is affected by hand soldering.

Precautionary Notes

Handling of Moisture-Sensitive Devices

This product has a Moisture Sensitive Level 2a rating per JEDEC

J-STD-020. Refer to Broadcom Application Note AN5305,

Handling of Moisture Sensitive Surface Mount Devices, for

additional details and a review of proper handling procedures.



Before use:

—

An unopened moisture barrier bag (MBB) can be

stored at < 40°C / 90% RH for 12 months. If the actual

shelf life has exceeded 12 months and the humidity

indicator card (HIC) indicates that baking is not

required, it is safe to reflow the LEDs per the original

MSL rating.

—

Do not open the MBB prior to assembly (for example,

for IQC).



Control after opening the MBB:

—

Read the HIC immediately upon opening the MBB.

—

Keep the LEDs < 30°C / 60% RH at all times, and

complete all high temperature-related processes, such

as soldering, curing, or rework, within 672 hours.



Control for unfinished reel:

Store unused LEDs in a sealed MBB with desiccant or

desiccator at < 5% RH.



Control of assembled boards:

If the PCB soldered with the LEDs is to be subjected to

other high temperature processes, store the PCB in a

sealed MBB with desiccant or desiccator at < 5% RH to

ensure that all LEDs have not exceeded their floor life of

672 hours.



Baking is required if the following conditions exist:

—

The HIC indicator is not blue at 10% and is pink at 5%.

—

The LEDs are exposed to conditions of > 30°C / 60% RH

at any time.

—

The LED floor life exceeded 672 hours.

The recommended baking condition is: 60°C ± 5ºC for

20 hours.

Bake the LED only once.

217°C

200°C

60s to 120s

6 °C/s max.

3 °C/s max.

s max.

/

C

°

3

150°C

255°C to 260°C

60s max.

10s max.

Time