HC55130IMZ datasheet(4/36 Pages) RENESAS

4 / 36 page

HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150

FN4659 Rev 13.00

Page 4 of 36

June 1, 2006

Absolute Maximum Ratings TA = 25°C

Thermal Information

Temperature, Humidity

Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C

Operating Temperature Range. . . . . . . . . . . . . . . . -40°C to 110°C

Operating Junction Temperature Range . . . . . . . .-40°C to 150°C

Power Supply (-40°C

 TA  85°C)

Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . -0.4V to 7V

Supply Voltage VBL to GND . . . . . . . . . . . . . . . . . . . .-VBH to 0.4V

Supply Voltage VBH to GND, Continuous . . . . . . . . . -75V to 0.4V

Supply Voltage VBH to GND, 10ms . . . . . . . . . . . . . . -80V to 0.4V

Relay Driver

Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V

Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA

Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to VCC

Output Voltage (SHD, GKD_LVM Not Active) . . . . . -0.4V to VCC

Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V

Gate Count. . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes

Tipx and Ringx Terminals (-40°C

TA85°C)

Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA

Thermal Resistance (Typical, Note 1)

JA

28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .

52°C/W

28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . .

45°C/W

32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .

66.2°C/W

Continuous Power Dissipation at 85°C

28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W

28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0W

32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4W

Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . 300°C

(PLCC, SOIC - Lead Tips Only)

Derate above 70°C

Tip and Ring Terminals

Tipx or Ringx, Current, Pulse < 10ms, TREP > 10s . . . . . . . . . .2A

Tipx or Ringx, Current, Pulse < 1ms, TREP > 10s . . . . . . . . . . .5A

Tipx or Ringx, Current, Pulse < 10

s, TREP > 10s . . . . . . . . .15A

Tipx or Ringx, Current, Pulse < 1

s, TREP > 10s . . . . . . . . . .20A

Tipx or Ringx, Pulse < 250ns, TREP > 10s

20A

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

JA is measured with the component mounted on an evaluation PC board in free air.

Typical Operating Conditions

These represent the conditions under which the device was developed and are suggested as guidelines.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Ambient Temperature

HC55120, HC55150/1

°C

HC55121, HC55130/1, HC55140/1,

HC55142/3

-40

°C

VBH with Respect to GND

-58

-8

VBL with Respect to GND

VBH

-0

VCC with Respect to GND

4.75

5.25

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