ISL6334D

FN6802 Rev 4.00

Page 3 of 28

Apr 29, 2016

Pin Configuration

ISL6334D

(40 LD QFN)

TOP VIEW

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(RoHS Compliant)

PKG.

DWG. #

ISL6334DIRZ

6334D IRZ

-40 to +85

40 Ld 6x6 QFN

L40.6x6

ISL6334DCRZ

6334D CRZ

0 to +70

40 Ld 6x6 QFN

L40.6x6

NOTES:

1. Add “-T” suffix for a 4k unit tape and reel option. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6334D. For more information on MSL please see techbrief TB363.

TABLE 1. ISL6336x/4x FAMILY SUMMARY

INTERSIL PN

NUMBER OF PHASES

DIODE

EMULATION

DROOP

H_CPURST_N INPUT

TARGETED APPLICATIONS

ISL6336

6Yes

Yes

No

VR11.x CPU

ISL6336A

6

No

Yes

No

VR11.x CPU

ISL6336D

6

No

No

No

General Purpose, Memory

ISL6334

4Yes

Yes

No

VR11.x CPU

ISL6334A

4

No

Yes

No

VR11.x CPU

ISL6334D

4

No

No

No

General Purpose, Memory

VID5

VID4

VID3

VID2

VID1

PSI#

IMON

VID0

OFS

VID6

ISEN3-

ISEN3+

ISEN1+

ISEN1-

PWM1

PWM4

ISEN4-

ISEN4+

ISEN2+

ISEN2-

1

40

2

3

4

5

6

7

8

9

10

30

29

28

27

26

25

24

23

22

21

39

38

37

36

35

34

33

32

31

11

12

13

14

15

16

17

18

19

20

GND