TUSB1044 datasheet(6/67 Pages) TI1

6 / 67 page

TUSB1044

SLLSF47B – FEBRUARY 2018 – REVISED APRIL 2018

www.ti.com

Product Folder Links: TUSB1044

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage range

-0.3

VIN_DIFF

Differential voltage at differential input pins.

±2.5

VIN_SE

Single-ended input voltage at differential input pins.

-0.5

VIN_CMOS

Input voltage at CMOS inputs

-0.3

Tstg

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±5000

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3.3

3.6

VI2C

Supply that external resistors on SDA and SCL are pulled up to.

1.7

3.6

VPSN

Power supply noise on VCC

100

TUSB1044 Ambient temperature

°C

TUSB1044i Ambient temperature

-40

°C

Junction temperature

-40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TUSB1044

UNIT

RNQ (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

20.7

°C/W

RθJB

Junction-to-board thermal resistance

9.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

9.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.3

°C/W

TUSB1044 датащи(PDF) 6 Page - Texas Instruments

TUSB1044 датащи(HTML) 6 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67

датащи скачать

ссылки URL