MP6529 datasheet(3/13 Pages) MPS

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MP6529 – 5V TO 35V, THREE-PHASE BLDC MOTOR PRE-DRIVER

MP6529 Rev. 1.0

www.MonolithicPower.com

10/26/2015

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

PACKAGE REFERENCE

TOP VIEW

QFN-28 (4mmx4mm)

TSSOP-28 EP (9.7mmx6.4mm)

ABSOLUTE MAXIMUM RATINGS (1)

Input voltage (VIN) ...........................-0.3V to 40V

CPA ................................................-0.3V to 40V

CPB .............................................-0.3V to 12.5V

VREG..............................................-0.3V to 13V

BSTA/B/C .......................................-0.3V to 55V

GHA/B/C .........................................-0.3V to 55V

SHA/B/C .........................................-0.3V to 40V

GLA/B/C..........................................-0.3V to 13V

All other pins to AGND...................-0.3V to 6.5V

Continuous power dissipation (TA = +25°C)

(2)

QFN-28 (4mmx4mm)………………….…...2.9W

TSSOP-28 EP (9.7mmx6.4mm)………....3.9W

Storage temperature................ -55

°C to +150°C

Junction temperature ..............................+150

°C

Lead temperature (solder) ......................+260

°C

Recommended Operating Conditions

(3)

Input voltage (VIN) ...............................5V to 35V

OC_REF voltage (VOC) ...............0.125V to 2.4V

Operating junct. temp (TJ)........ -40°C to +125°C

Thermal Resistance

(4)

θJA θJC

QFN-28 (4mmx4mm)...........…...42.... .9 ... °C/W

TSSOP-28 EP (9.7mmx6.4mm)..32 ... .6 ... °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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