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ISL6553CBZ датащи(PDF) 13 Page - Renesas Technology Corp

номер детали ISL6553CBZ
подробное описание детали  Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller
PDF  15 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL6553CBZ датащи(HTML) 13 Page - Renesas Technology Corp

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ISL6553
FN4931 Rev 1.00
Page 13 of 15
August 2004
Component Selection Guidelines
Output Capacitor Selection
The output capacitor is selected to meet both the dynamic load
requirements and the voltage ripple requirements. The load
transient for the microprocessor CORE is characterized by
high slew rate (di/dt) current demands. In general, multiple
high quality capacitors of different size and dielectric are
paralleled to meet the design constraints.
Modern microprocessors produce severe transient load rates.
High frequency capacitors supply the initially transient current
and slow the load rate-of-change seen by the bulk capacitors.
The bulk filter capacitor values are generally determined by the
ESR (effective series resistance) and voltage rating
requirements rather than actual capacitance requirements.
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors. The
bulk capacitor’s ESR determines the output ripple voltage and
the initial voltage drop following a high slew-rate transient’s
edge. In most cases, multiple capacitors of small case size
perform better than a single large case capacitor.
Bulk capacitor choices include aluminum electrolytic, OS-Con,
Tantalum and even ceramic dielectrics. An aluminum
electrolytic capacitor’s ESR value is related to the case size
with lower ESR available in larger case sizes. However, the
equivalent series inductance (ESL) of these capacitors
increases with case size and can reduce the usefulness of the
capacitor to high slew-rate transient loading. Unfortunately,
ESL is not a specified parameter. Consult the capacitor
manufacturer and measure the capacitor’s impedance with
frequency to select a suitable component.
Output Inductor Selection
One of the parameters limiting the converter’s response to a
load transient is the time required to change the inductor
current. Small inductors in a multi-phase converter reduces the
response time without significant increases in total ripple
current.
The output inductor of each power channel controls the ripple
current. The control IC is stable for channel ripple current
(peak-to-peak) up to twice the average current. A single
channel’s ripple current is approximately:
The current from multiple channels tend to cancel each other
and reduce the total ripple current. Figure 12 gives the total
ripple current as a function of duty cycle, normalized to the
parameter
at zero duty cycle. To determine the
total ripple current from the number of channels and the duty
cycle, multiply the y-axis value by
.
Small values of output inductance can cause excessive power
dissipation. The ISL6553 is designed for stable operation for
ripple currents up to twice the load current. However, for this
condition, the RMS current is 115% above the value shown in
the following MOSFET Selection and Considerations section.
With all else fixed, decreasing the inductance could increase the
power dissipated in the MOSFETs by 30%.
I
VIN VOUT
–
FSWxL
--------------------------------
VOUT
VIN
----------------
=
Vo
 LFS

Vo
 LxFSW

VCORE
+12V
VIA CONNECTION TO GROUND PLANE
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
LO1
COUT
CIN
+5VIN
KEY
PHASE
VCC
USE INDIVIDUAL METAL RUNS
COMP
ISL6553
PWM
RT
RIN
RFB
CBP
FB
VSEN
ISEN
RSEN
HIP6601
CBOOT
CBP
CT
VCC
FS/DIS
PVCC
LOCATE NEXT TO IC PIN
LOCATE NEXT
TO FB PIN
LOCATE NEXT TO IC PIN(S)
ISOLATE OUTPUT STAGES
FOR EACH CHANNEL TO HELP
LOCATE NEAR TRANSISTOR
FIGURE 11. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS



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