MP6508GF datasheet(3/15 Pages) MPS

3 / 15 page

MP6

508 – 2.7V-TO-18V, 1.2A STEPPER MOTOR DRIVER

MP6508 Rev.1.0

www.MonolithicPower.com

6/27/2017

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

PACKAGE REFERENCE

AIN2

nSLEEP

SENA

AOUT2

BOUT2

SENB

BOUT1

FAULT

AOUT1

VIN

BST

BIN2

BIN1

AIN1

VDD

GND

MP6508

EXPOSED PAD ON

BACKSIDE

CONNECTED TO GND

SENA

AOUT2

SENB

VIN

GND

VDD

BST

BOUT2

EXPOSED PAD ON

BACKSIDE

CONNECTED TO GND

MP6508

TSSOP-16 EP

QFN-16 (4mm×4mm)

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage VIN ......................... -0.3V to 20V

AOUTx Voltage VAOUTx ...............-0.3V to VIN+1V

BOUTx Voltage VBOUTx ...............-0.3V to VIN+1V

BST Voltage VBST....................-0.3V to VIN+6.5V

Sense Voltage VSENx ..................... -0.3V to 0.5V

All Other Pins................................ -0.3V to 6.5V

Junction Temperature .............................. 150°C

Lead Temperature ................................... 260°C

Continuous Power Dissipation (TA = +25°C)

(2)

QFN-16 (4mm×4mm).................................2.7W

TSSOP-16 EP ...........................................2.8W

Operating Temperature.............. -40°C to +85°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .......................... 2.7V to 18V

Output Current IA/BOUT..................................1.2A

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN-16(4mm×4mm) ..............46 ...... 10 ...°C/W

TSSOP-16 EP ........................45 ...... 10 ...°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal

resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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