SC105.....5. Series

2

Bulletin I0503J 12/99

www.irf.com

SC105xxxxx5

B

Inked Probed Unsawn Wafer (Wafer in Box)

1150

SC105xxxxx5

R

Probed Die in Tape & Reel

3000

SC105xxxxx5

P

Probed Die in Waffle Pack

1150

SC105xxxxx5

F

Inked Probed Sawn Wafer on Film

1150

Device

Package

#

(°C)

(V)

(µA)

(mA)

(V)

Style

SC105

125

15

3000

n.a. contact factory

SC105

125

20

n.a. contact factory

SC105

150

30

220

100

0.49 @ 15A

TO-220

SC105

150

45

150

75

0.54 @ 15A

TO-247

SC105

150

60

110

60

0.60 @ 15A

TO-247

SC105

175

45

35

10

0.62 @ 15A

TO-220

SC105

175

100

12

7

0.86 @ 15A

TO-247

SC105

175

150

15

7

1.00 @ 15A

TO-220

Electrical Characteristics

Device

Metal Thickness

Metal Thickness

#

Front Metal

Back Metal

SC105xxxx

Bondable

--

Al/Si 30 kÅ

--

Cr 1 kÅ

Ni 4 kÅ

Ag 6 kÅ

SC105xxxx

Solderable

Ti 2 kÅ

Ni 6 kÅ

Ag 35 kÅ

Cr 1 kÅ

Ni 4 kÅ

Ag 6 kÅ

Mechanical Data

Device

Description

Minimum Order Quantity

#

Wafer in Sale Package

Packaging

Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.

Shelf life for parts stored in above condition is 2 years.

If the storage is done in normal atmosphere shelf life is reduced to six months.