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Notes

A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.

B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.

C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled

to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp

50Ω

5 to 43.5 GHz

Product Features

• Wide bandwidth, 5 to 43.5 GHz

• Excellent Coupling Flatness, ±0.6 dB over 20 to 40 GHz

• Nominal Coupling 18.6 dB over 20 to 40 GHz

• DC passing

REV. OR

M165761

EBDC19-KA-D+

RS/CP

180220

General Description

Mini-Circuits’ EBDC19-KA-D+ is a Bi-Directional Coupler die designed for wideband operation from 5 to

43.5 GHz with a nominal coupling of 18.7 dB over 20-40 GHz. Manufactured using GaAs IPD technology,

it has excellent repeatability and excellent reliability.

Typical Applications

• 5G

• Instrumentation

• Military

MMIC

+RoHS Compliant

The +Suffix identifies RoHS Compliance. See our web site

for RoHS Compliance methodologies and qualifications

Ordering Information: Refer to Last Page

Simplified Schematic and Pad description

Bonding Pad Position

Note: 1. Bond Pad material - Gold

2. Bottom of Die - Gold plated

Dimensions in µm, Typical

L1

L2

L3

L4

L5

H1

H2

H3

H4

H5

134

392

1199 1456 1590 124

370

921

1166 1290 100 117 x 167 167 x 117

Pad#

Function

1

Input

2

Output

4

Couple Forward

3

Couple Reverse

Die Bottom

Ground