ISL6207CB datasheet(4/10 Pages) RENESAS

4 / 10 page

ISL6207

FN9075 Rev 8.00

Page 4 of 10

December 2, 2005

Absolute Maximum Ratings

Thermal Information

Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V

Input Voltage (VEN, VPWM) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V

BOOT Voltage (VBOOT). . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V

BOOT to PHASE Voltage (VBOOT-PHASE) . . . . . . . . . . . -0.3V to 7V

PHASE Voltage . . . . . . . . . . . . . GND - 0.3V (DC) to VBOOT + 0.3V

. . . . . . . . . GND - 5V (<100ns Pulse Width, 10µJ) to VBOOT + 0.3V

UGATE Voltage . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT + 0.3V

. . . . . . .VPHASE - 4V (<200ns Pulse Width, 20µJ) to VBOOT + 0.3V

LGATE Voltage . . . . . . . . . . . . . . GND - 0.3V (DC) to VVCC + 0.3V

. . . . . . . . . . . GND - 2V (<100ns Pulse Width, 4µJ) to VVCC + 0.3V

Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 125°C

Recommended Operating Conditions

Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-10°C to 100°C

Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C

Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%

Thermal Resistance (Typical)

JA (°C/W) JC (°C/W)

SOIC Package (Note 2) . . . . . . . . . . . .

110

N/A

QFN Package (Notes 3, 4). . . . . . . . . .

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C

Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.

JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

4. For

JC, the “case temp” location is the center of the exposed metal pad on the package underside.

Electrical Specifications

Recommended Operating Conditions, Unless Otherwise Noted.

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

VCC SUPPLY CURRENT

Bias Supply Current

IVCC

EN = LOW

5.0

A

Bias Supply Current

IVCC

PWM pin floating, VVCC = 5V

A

BOOTSTRAP DIODE

Forward Voltage

VVCC = 5V, forward bias current = 2mA

0.45

0.60

0.65

PWM INPUT

Input Current

IPWM

VPWM = 5V

250

A

VPWM = 0V

-250

A

PWM Three-State Rising Threshold

VVCC = 5V

1.7

PWM Three-State Falling Threshold

VVCC = 5V

3.3

Three-State Shutdown Holdoff Time

VVCC = 5V, temperature = 25°C

300

EN INPUT

EN LOW Threshold

1.0

EN HIGH Threshold

2.0

SWITCHING TIME

UGATE Rise Time (Note 5)

tRUGATE

VVCC = 5V, 3nF Load

LGATE Rise Time (Note 5)

tRLGATE

VVCC = 5V, 3nF Load

UGATE Fall Time (Note 5)

tFUGATE

VVCC = 5V, 3nF Load

LGATE Fall Time (Note 5)

tFLGATE

VVCC = 5V, 3nF Load

UGATE Turn-Off Propagation Delay

tPDLUGATE VVCC = 5V, Outputs Unloaded

LGATE Turn-Off Propagation Delay

tPDLLGATE VVCC = 5V, Outputs Unloaded

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