MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

9

Electrical and Thermal Characteristics

Table 3 provides the recommended operating conditions for the MPC755.

Table 4 provides the package thermal characteristics for the MPC755 and MPC745. The MPC755 was initially

sampled in a CBGA package, but production units are currently provided in both a CBGA and a PBGA package.

Because of the better long-term device-to-board interconnect reliability of the PBGA package, Freescale

recommends use of a PBGA package except where circumstances dictate use of a CBGA package. The MPC745 is

offered in a PBGA package only.

Characteristic

Symbol

Recommended Value

Unit

Notes

300 MHz, 350 MHz

400 MHz

Min

Max

Min

Max

Core supply voltage

1.80

2.10

1.90

2.10

V

3

PLL supply voltage

1.80

2.10

1.90

2.10

V

3

L2 DLL supply voltage

1.80

2.10

1.90

2.10

V

3

Processor bus

supply voltage

BVSEL = 1

2.375

2.625

2.375

2.625

V

2, 4

3.135

3.465

3.135

3.465

5

L2 bus supply

voltage

L2VSEL = 1

2.375

2.625

2.375

2.625

V

2, 4

3.135

3.465

3.135

3.465

5

Input voltage

Processor bus

GND

GND

V

L2 bus

GND

GND

V

JTAG signals

GND

GND

V

Die-junction temperature

0

105

0

105

°C

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.

2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support. For more information, refer to Section 10.2, “Part Numbers Not Fully

Addressed by This Document.”

3. 2.0 V nominal.

4. 2.5 V nominal.

5. 3.3 V nominal.