Datasheet

4

1.0

2017-12-07

TLE94004EP

Pin Configuration

1

Pin Configuration

1.1

Pin Assignment

Figure 1

Pin Configuration TLE94004EP with direct interface

1.2

Pin Definitions and Functions

Pin

Symbol

Function

1

IN 1

Direct input control for power half-bridge 1

2

IN 2

Direct input control for power half-bridge 2

3

IN 3

Direct input control for power half-bridge 3

4

IN 4

Direct input control for power half-bridge 4

5

VS

Main supply voltage for power half bridges.

6OUT 3

Power half-bridge 3

7OUT 1

Power half-bridge 1

8GND

Ground

9OUT 2

Power half-bridge 2

10

OUT 4

Power half-bridge 4

11

EN1

Enable input for Half-bridges 1/2 with internal pull-down

12

EN2

Enable input for Half-bridges 3/4 with internal pull-down

13

EF

Error Flag

14

VDD

Logic supply voltage

EDP

-

Exposed Die Pad; For cooling and EMC purposes only - not usable as electrical

1) The exposed die pad at the bottom of the package allows better heat dissipation from the device via the PCB. The

exposed pad (EP) must be either left open or connected to GND. It is recommended to connect EP to GND for best

EMC and thermal performance.

IN 1

VDD

IN 2

IN 3

IN 4

VS

OUT 3

OUT 1

EN2

EN1

EF

OUT 4

OUT 2

GND

1

2

3

4

5

6

7

14

13

12

11

10

9

8