LTC4235

4

4235f

For more information www.linear.com/LTC4235

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Inputs

D2OFF Pin High Threshold

D2OFF Rising

l

1.21

1.235

1.26

V

D2OFF Pin Low Threshold

D2OFF Falling

l

1.19

1.215

1.24

V

l

10

20

30

mV

ON Pin Threshold Voltage

ON Rising

l

1.21

1.235

1.26

V

ON Pin Fault Reset Threshold Voltage

ON Falling

l

0.57

0.6

0.63

V

ON Pin Hysteresis

l

40

80

120

mV

Input Leakage Current (ON, D2OFF)

V = 5V

l

0

±1

µA

EN Pin Threshold Voltage

EN Rising

l

1.185

1.235

1.284

V

EN Pin Hysteresis

l

60

110

200

mV

EN Pull-Up Current

EN = 1V

l

–7

–10

–13

µA

FTMR Pin High Threshold

l

1.198

1.235

1.272

V

FTMR Pin Low Threshold

l

0.15

0.2

0.25

V

FTMR Pull-Up Current

FTMR = 1V, In Fault Mode

l

–80

–100

–120

µA

FTMR Pull-Down Current

FTMR = 2V, No Faults

l

1.3

2

2.7

µA

Auto-Retry Duty Cycle

l

0.07

0.15

0.23

%

ON Low to FAULT High

l

20

40

µs

Outputs

OUT Pin Current

OUT = 11V, IN = 12V, ON = 2V

OUT = 13V, IN = 12V, ON = 2V

l

l

30

100

2.5

170

4

µA

mA

Output Low Voltage (FAULT, PWRGD)

I = 1mA

I = 3mA

l

l

0.15

0.4

0.4

1.2

V

V

Output High Voltage (FAULT, PWRGD)

I = –1µA

l

– 1

– 0.5

V

Input Leakage Current (FAULT, PWRGD) V = 18V

l

0

±1

µA

Output Pull-Up Current (FAULT, PWRGD) V = 1.5V

l

–7

–10

–13

µA

Current Monitor

Floating Regulator Voltage

l

3.6

4.1

4.6

V

Input Sense Voltage Full Scale

l

25

mV

IMON Input Offset Voltage

l

±150

µV

IMON Voltage Gain

l

99

100

101

V/V

IMON Maximum Output Voltage

l

3.5

5.5

V

IMON Minimum Output Voltage

l

40

mV

IMON Output Resistance

l

15

20

27

kΩ

l

denotes the specifications which apply over the full operating

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: All currents into device pins are positive; all currents out of

the device pins are negative. All voltages are referenced to GND unless

otherwise specified.

Note 3: An internal clamp limits the DGATE and CPO pins to a minimum of

10V above and a diode below IN. Driving these pins to voltages beyond the

clamp may damage the device.

Note 4: An internal clamp limits the HGATE pin to a minimum of 10V

above and a diode below OUT. Driving this pin to voltages beyond the

clamp may damage the device.

Note 5: Thermal resistance is specified when the exposed pad is soldered

to a 3" x 5", four layer, FR4 board.