LTC2271 datasheet(20/22 Pages) LINER

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LTC2385-18

238518f

For more information www.linear.com/LTC2385-18

Figure 13. Valid Time Window for Clocking Out Data

tFIRSTCLK

tLASTCLK

238518 F13

CNV

CLK

TIME WINDOW FOR CLOCKING OUT CONVERSION N

CONVERSION N

CONVERSION N+1

to run any digital track alongside an analog signal track

or underneath the ADC.

High quality ceramic bypass capacitors should be used

at the VDD, VDDL, OVDD, VCM, REFIN, and REFBUF pins.

Bypass capacitors must be located as close to the pins as

possible. Size 0402 ceramic capacitors are recommended

(except for REFBUF). The traces connecting the pins and

bypass capacitors must be kept short and should be made

as wide as possible.

Of particular importance is the capacitor between REFBUF

and REFGND, which should be a 10μF (X7R, 0805 size)

ceramic capacitor. This capacitor should be on the same

side of the circuit board as the ADC, and as close to the

device as possible. Adding a second, smaller capacitor in

parallel with the 10μF may degrade performance and is

not recommended.

Theanaloginputs,convertstart,anddigitaloutputsshould

not be routed next to each other. Ground fill and grounded

vias should be used as barriers to isolate these signals

from each other.

Exposed Package Pad

For good electrical and thermal performance, the exposed

pad on the bottom of the package must be soldered to a

large grounded pad on the PC board. This pad should be

connectedtotheinternalgroundplanesbyanarrayofvias.

Mechanical Stress Shift

The mechanical stress of mounting a part to a board can

cause subtle changes to the SNR and internal voltage

reference. The best soldering method is to use IR reflow

or convection soldering with a controlled temperature

profile. Hand soldering with a heat gun or a soldering iron

is not recommended.

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