| поискавой системы для электроныых деталей |
|
LT8613 датащи(PDF) 25 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LT8613 датащи(HTML) 25 Page - Linear Technology |
|
25 / 26 page ![]() LT8619/LT8619-5 25 8619f For more information www.linear.com/LT8619 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. PACKAGE DESCRIPTION MSOP (MSE16) 0213 REV F 0.53 ±0.152 (.021 ±.006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 –0.27 (.007 – .011) TYP 0.86 (.034) REF 0.50 (.0197) BSC 16 16151413121110 1 2 3 4 5 6 7 8 9 9 1 8 NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 0.254 (.010) 0 ° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 5.10 (.201) MIN 3.20 – 3.45 (.126 – .136) 0.889 ±0.127 (.035 ±.005) RECOMMENDED SOLDER PAD LAYOUT 0.305 ±0.038 (.0120 ±.0015) TYP 0.50 (.0197) BSC BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ±0.102 (.112 ±.004) 2.845 ±0.102 (.112 ±.004) 4.039 ±0.102 (.159 ±.004) (NOTE 3) 1.651 ±0.102 (.065 ±.004) 1.651 ±0.102 (.065 ±.004) 0.1016 ±0.0508 (.004 ±.002) 3.00 ±0.102 (.118 ±.004) (NOTE 4) 0.280 ±0.076 (.011 ±.003) REF 4.90 ±0.152 (.193 ±.006) DETAIL “B” DETAIL “B” CORNER TAIL IS PART OF THE LEADFRAME FEATURE. FOR REFERENCE ONLY NO MEASUREMENT PURPOSE 0.12 REF 0.35 REF MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F) Please refer to http://www.linear.com/product/LT8619#packaging for the most recent package drawings. MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F) |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |