SFH 7770

2011-09-16

21

Pb-Free (SnAgCu) Assembly

Profile Feature

Recommendation

Max. Ratings

Ramp-up Rate to Preheat*

)

25°C to 150°C

2°C / sec

3°C / sec

Time t

(150°C to 200°C

100s

min. 60sec max. 120sec

Ramp-up Rate to Peak*

)

T

2°C / sec

3°C / sec

Liquidus Temperture T

L

217°C

Time t

80sec

max. 100sec

Peak Temperature T

P

245°C

max. 260°C

Time t

temperature T

20sec

min. 10sec max. 30sec

Ramp-down Rate*

T

3°C / sec

6°C / sec maximum

Time 25°C to Peak temperature

max. 8 min.

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation T/ t: t max. 5 sec; fulfillment for the whole T-range