LTM8049 datasheet(15/20 Pages) LINER

15 / 20 page

LTM8067

8067fc

For more information www.linear.com/LTM8067

APPLICATIONS INFORMATION

confusion andinconsistency.Thesedefinitionsaregivenin

JESD 51-12, and are quoted or paraphrased as follows:

θJA is the natural convection junction-to-ambient air

thermal resistance measured in a one cubic foot sealed

enclosure. This environment is sometimes referred to

as still air although natural convection causes the air to

move. This value is determined with the part mounted to a

JESD 51-9 defined test board, which does not reflect an

actual application or viable operating condition.

θJCbottom is the junction-to-board thermal resistance with

allofthecomponentpowerdissipationflowingthroughthe

bottom of the package. In the typical µModule converter,

the bulk of the heat flows out the bottom of the package,

but there is always heat flow out into the ambient envi-

ronment. As a result, this thermal resistance value may

be useful for comparing packages but the test conditions

don’t generally match the user’s application.

θJCtopisdeterminedwithnearlyallofthecomponentpower

dissipation flowing through the top of the package. As the

electricalconnectionsofthetypicalµModuleconverterare

on the bottom of the package, it is rare for an application

to operate such that most of the heat flows from the junc-

tion to the top of the part. As in the case of θJCbottom, this

value may be useful for comparing packages but the test

conditions don’t generally match the user’s application.

θJCboardisthejunction-to-boardthermalresistancewhere

almost all of the heat flows through the bottom of the

µModule converter and into the board, and is really the

sum of the θJCbottom and the thermal resistance of the

bottom of the part through the solder joints and through a

portion of the board. The board temperature is measured

a specified distance from the package, using a two-sided,

two-layer board. This board is described in JESD 51-9.

Giventhesedefinitions,itshouldnowbeapparentthatnone

of these thermal coefficients reflects an actual physical

operating condition of a µModule converter. Thus, none

of them can be individually used to accurately predict the

thermal performance of the product. Likewise, it would

be inappropriate to attempt to use any one coefficient to

correlate to the junction temperature vs load graphs given

in the product’s data sheet. The only appropriate way to

use the coefficients is when running a detailed thermal

analysis, such as FEA, which considers all of the thermal

resistances simultaneously.

A graphical representation of these thermal resistances

is given in Figure 3.

The blue resistances are contained within the µModule

converter, and the green are outside.

The die temperature of the LTM8067 must be lower than

the maximum rating of 125°C, so care should be taken in

the layout of the circuit to ensure good heat sinking of the

LTM8067. The bulk of the heat flow out of the LTM8067

is through the bottom of the module and the BGA pads

into the printed circuit board. Consequently a poor printed

circuit board design can cause excessive heating, result-

ing in impaired performance or reliability. Please refer to

the PCB Layout section for printed circuit board design

suggestions.

Figure 3. Approximate Thermal Model of LTM8067

8067 F03

µMODULE DEVICE

JUNCTION-TO-CASE (TOP)

RESISTANCE

JUNCTION-TO-BOARD RESISTANCE

JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)

CASE (TOP)-TO-AMBIENT

RESISTANCE

BOARD-TO-AMBIENT

RESISTANCE

JUNCTION-TO-CASE

(BOTTOM) RESISTANCE

JUNCTION

AMBIENT

CASE (BOTTOM)-TO-BOARD

RESISTANCE

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