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LT8302 датащи(PDF) 14 Page - Linear Technology |
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LT8302 датащи(HTML) 14 Page - Linear Technology |
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14 / 20 page ![]() LTM8068 14 8068fb For more information www.linear.com/LTM8068 APPLICATIONS INFORMATION 5. Connect all of the GND connections to as large a cop- per pour or plane area as possible on the top layer. Avoid breaking the ground connection between the external components and the LTM8068. 6. Use vias to connect the GND copper area to the board’s internal ground planes. Liberally distribute these GND vias to provide both a good ground connection and thermal path to the internal planes of the printed circuit board. Pay attention to the location and density of the thermal vias in Figure 1. The LTM8068 can benefit from the heat sinking afforded by vias that connect to internal GND planes at these locations, due to their proximity to internal power handling components. The optimum number of thermal vias depends upon the printed circuit board design. For example, a board might use very small via holes. It should employ more thermal vias than a board that uses larger holes. Minimum Load Due to the nature of the flyback regulator in general, and the LTM8068 control scheme specifically, the LTM8068 requires a minimum load for proper operation. Otherwise, the output may go out of regulation if the load is too light. The most common way to address this is to place a resistor across the output. The Minimum Load Current vs VOUT Over Full Output Voltage Range graph in the Typical Performance Characteristics section of may be used as a guide in selecting the resistor. Note that this graph describes room temperature operation. If the end appli- cation operates at a colder temperature, the minimum load requirement may be higher and the minimum load condition must be characterized for the lowest operating temperature. If it is impractical to place a resistive load permanently across the output, a resistor and Zener diode may be used instead, as shown in Figure 2. While the minimum load resistor mentioned in the prior paragraph will always draw current while the LTM8068 output is powered, the series resistor-Zener diode combination will only draw current if the output is too high. When using this circuit, take care to ensure that the characteristics of the Zener diode are appropriate for the intended application’s tem- perature range. Figure 2: Use a Resistor and Zener Diode to Meet the Minimum Load Requirement LTM8068 VOUTP VOUTN 8068 F02 Hot-Plugging Safely The small size, robustness and low impedance of ceramic capacitors make them an attractive option for the input bypass capacitor of the LTM8068. However, these capaci- tors can cause problems if the LTM8068 is plugged into a live supply (see Linear Technology Application Note 88 for a complete discussion). The low loss ceramic capacitor combined with stray inductance in series with the power source forms an underdamped tank circuit, and the volt- age at the VIN pin of the LTM8068 can ring to more than twice the nominal input voltage, possibly exceeding the LTM8068’s rating and damaging the part. If the input supply is poorly controlled or the user will be plugging the LTM8068 into an energized supply, the input network should be designed to prevent this overshoot. This can be accomplished by installing a small resistor in series to VIN, but the most popular method of controlling input voltage overshoot is adding an electrolytic bulk capacitor to the VIN net. This capacitor’s relatively high equivalent series resistance damps the circuit and eliminates the voltage overshoot. The extra capacitor improves low frequency ripple filtering and can slightly improve the efficiency of the circuit, though it can be a large component in the circuit. Thermal Considerations The LTM8068 output current may need to be derated if it is required to operate in a high ambient temperature. The amount of current derating is dependent upon the input voltage, output power and ambient temperature. The temperature rise curves given in the Typical Performance Characteristics section can be used as a guide. These curves were generated by the LTM8068 mounted to a 58cm2 4-layer FR4 printed circuit board. Boards of other sizes and layer count can exhibit different thermal behavior, so it is incumbent upon the user to verify proper |
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