LTM8005

2

8005f

For more information www.linear.com/LTM8005

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

ISN Above LED..........................................................40V

CTRL1, CTRL2 ………………...................................15V

PWM, SHORTLED, OPENLED ...................................12V

FB, OVLO ....................................................................8V

Maximum Junction Temperature

(E-Grade, I-Grade, MP-Grade) .......................... 125°C

Maximum Junction Temperature (H-Grade).......... 150°C

Storage Temperature............................................. 150°C

Peak Solder Reflow Body Temperature .................260°C

(Note 1)

F

G

H

J

K

E

A

B

C

D

2

1

4

3

5

6

7

8

BGA PACKAGE

80-Pad (11.25mm × 9mm × 2.22mm)

TOP VIEW

GND

CTRL2

CTRL1

RT

SS

VC

FB

GND

BANK5

ISN

IVINN

BANK 2

SW

BANK 1

GND

IVINP

EN/UVLO

IVINCOMP

AUX

ISMON

BANK6

LED

BANK 3 DA

PWM

OVLO

VALUES DETERMINED PER JEDEC 15-9, 51-12

ORDER INFORMATION

Part Number

Terminal Finish

Part Marking*

Package Type

MSL Rating

Temperature Range

Device

Finish Code

LTM8005EY#PBF

SAC305 (RoHS)

LTM8005

e1

BGA

3

–40°C to 125°C

LTM8005IY#PBF

SAC305 (RoHS)

LTM8005

e1

BGA

3

–40°C to 125°C

LTM8005HY#PBF

SAC305 (RoHS)

LTM8005

e1

BGA

3

–40°C to 150°C

LTM8005MPY#PBF

SAC305 (RoHS)

LTM8005

e1

BGA

3

–55°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is identified by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking: www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures: www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings: www.linear.com/packaging

http://www.linear.com/product/LTM8005#orderinfo