LTM8046

2

8046fb

For more information www.linear.com/LTM8046

pin conFiguraTion

absoluTe MaxiMuM raTings

FB, SS .........................................................................5V

Maximum Internal Temperature (Note 3) .............. 125°C

Peak Solder Reflow Body Temperature ................. 245°C

(Note 1)

L

K

J

H

G

F

E

D

C

B

A

TOP VIEW

1

2

3

4

5

6

7

BANK 4

BANK 3

BANK 2

GND

RUN

FB

BIAS SS

BANK 1

BGA PACKAGE

51-LEAD (15mm

× 9mm × 4.92mm)

WEIGHT = 1.5g,

θ VALUES DETERMINED PER JEDEC 51-9, 51-12

orDer inForMaTion

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(See Note 3)

DEVICE

FINISH CODE

LTM8046EY#PBF

SAC305 (RoHS)

LTM8046Y

e1

BGA

3

–40°C to 125°C

LTM8046IY#PBF

SAC305 (RoHS)

LTM8046Y

e1

BGA

3

–40°C to 125°C

LTM8046IY

SnPb (63/37)

LTM8046Y

e0

BGA

3

–40°C to 125°C

LTM8046MPY#PBF

SAC305 (RoHS)

LTM8046Y

e1

BGA

3

–55°C to 125°C

LTM8046MPY

SnPb (63/37)

LTM8046Y

e0

BGA

3

–55°C to 125°C

Consult Marketing for parts specified with wider operating temperature

ranges. *Device temperature grade is indicated by a label on the shipping

container. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Pb-free and Non-Pb-free Part Markings:

www.linear.com/leadfree

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures:

www.linear.com/umodule/pcbassembly

• LGA and BGA Package and Tray Drawings:

www.linear.com/packaging