LTM4622 datasheet(21/28 Pages) LINER

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LTM4622

Rev F

For more information www.analog.com

SAFETY CONSIDERATIONS

The LTM4622 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

LAYOUT CHECKLIST/EXAMPLE

The high integration of LTM4622 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

Use large PCB copper areas for high current paths,

including VIN, GND, VOUT1 and VOUT2. It helps to

minimize the PCB conduction loss and thermal stress.

Place high frequency ceramic input and output

capacitors next to the VIN, PGND and VOUT pins to

minimize high frequency noise.

APPLICATIONS INFORMATION

Place a dedicated power ground layer underneath

the unit.

To minimize the via conduction loss and reduce

module thermal stress, use multiple vias for

interconnection between top layer and other

power layers.

Do not put via directly on the pad, unless they are

capped or plated over.

Use a separated SGND ground copper area for

components connected to signal pins. Connect the

SGND to GND underneath the unit.

For parallel modules, tie the VOUT, VFB, and COMP

pins together. Use an internal layer to closely con-

nect these pins together. The TRACK pin can be

tied a common capacitor for regulator soft-start.

Bring out test points on the signal pins for

monitoring.

Figure 23 gives a good example of the recommended

layout.

Figure 23. Recommended PCB Layout

4622 F23

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