LTM2885

20

2885fa

For more information www.linear.com/LTM2885

PACKAGE DESCRIPTION

PACKAGE TOP VIEW

4

PIN “A1”

CORNER

Y

X

aaa Z

aaa Z

BGA Package

42-Lead (22mm

× 9mm × 5.16mm)

(Reference LTC DWG# 05-08-1960 Rev A)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

2. ALL DIMENSIONS ARE IN MILLIMETERS

BALL DESIGNATION PER JESD MS-028 AND JEP95

4

3

DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.

THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR

MARKED FEATURE

DETAIL A

Øb (42 PLACES)

DETAIL B

SUBSTRATE

A

A1

b1

ccc Z

DETAIL B

PACKAGE SIDE VIEW

MOLD

CAP

Z

M

X Y

Z

ddd

M Z

eee

SYMBOL

A

A1

A2

b

b1

D

E

e

F

G

H1

H2

aaa

bbb

ccc

ddd

eee

MIN

4.91

0.50

4.41

0.60

0.60

0.46

3.95

NOM

5.16

0.60

4.56

0.75

0.63

22.0

9.0

1.27

20.32

7.62

0.56

4.00

MAX

5.41

0.70

4.71

0.90

0.66

0.66

4.05

0.15

0.10

0.15

0.15

0.08

NOTES

DIMENSIONS

TOTAL NUMBER OF BALLS: 42

A2

D

E

SUGGESTED PCB LAYOUT

TOP VIEW

0.00

8.89

10.16

7.62

10.16

8.89

7.62

9.84

10.48

H2

H1

5. PRIMARY DATUM -Z- IS SEATING PLANE

6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu

0.63 ±0.025 Ø 42x

BGA 42 0314 REV A

TRAY PIN 1

BEVEL

PACKAGE IN TRAY LOADING ORIENTATION

COMPONENT

PIN “A1”

LTMXXXXXX

µModule

7

PACKAGE ROW AND COLUMN LABELING MAY VARY

AMONG µModule PRODUCTS. REVIEW EACH PACKAGE

LAYOUT CAREFULLY

!

PACKAGE BOTTOM VIEW

T

S

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

1

2

3

4

5

6

7

DETAIL A

3

SEE NOTES

PIN 1

e

e

F

G

b

7

SEE NOTES

b

Please refer to http://www.linear.com/product/LTM2885#packaging for the most recent package drawings.