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LTC7004 датащи(PDF) 13 Page - Linear Technology |
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LTC7004 датащи(HTML) 13 Page - Linear Technology |
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13 / 18 page ![]() LTC7004 13 7004fa For more information www.linear.com/LTC7004 Figure 7. Protecting Load from Voltage Drops on VIN TGUP TGDN TS INP 7004 F07 LTC7004 M1A M1B VIN LOAD Reverse Input Protection To protect the load from discharging back into VIN when the external MOSFET is off and the VIN voltage drops below the load voltage, two external N-channel MOSFETs should be used and must be in a back-to-back arrange- ment as shown in Figure 7. Dual N-channel packages such as the following devices are good choices for space saving designs: • FDS3890, Fairchild/ON Semiconductor • IRF7380PbF, Infineon/IR • SQJB80EP, Vishay/Siliconix PC Board Layout Considerations 1. Solder the exposed pad on the backside of the LTC7004 package directly to the ground plane of the board. 2. Limit the resistance of the TS trace, by making it short and wide. 3. CB needs to be close to chip. 4. Always include an option in the PC board layout to place aresistorinserieswiththegateofanyexternalMOSFET. High frequency oscillations are design dependent, and having the option to add a series dampening resistor can save a design iteration of the PC board. APPLICATIONS INFORMATION |
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