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LTC4371 датащи(PDF) 3 Page - Linear Technology |
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LTC4371 датащи(HTML) 3 Page - Linear Technology |
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3 / 22 page ![]() LTC4371 3 4371f For more information www.linear.com/LTC4371 elecTrical characTerisTics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C, IZ = 50µA, VDD = 12.4V, SA = SB = VSS unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VDD Input Supply Range l 4.5 16 V IDD Input Supply Current Normal Operation Gate Fault to VSS ,Strong Pull-Up Disabled Gate Fault to VSS, Strong Pull-Up Enabled ∆VSD = ±0.1V VZ = 10.4V, ∆VSD = 0.1V, One GATE = VSS IZ = 50µA, ∆VSD = 0.1V, One GATE = VSS l l l 200 400 4.5 300 550 7 450 750 9.5 µA µA mA VZ Shunt Regulator Voltage IZ = 50µA l 11.8 12.4 14 V ∆VZ Shunt Regulator Load Regulation IZ = 50µA to 10mA l 600 mV VZ(PU) VZ High Threshold to Enable Strong Gate Pull-Up VDD = VZ Rising l 10.7 11.2 11.8 V ∆VZ(PU) VZ High Threshold Hysteresis 0.5 V VZ(PU) VZ Low Threshold to Enable Strong Gate Pull-Up VZ Falling l 1.15 1.25 1.35 V ∆VSD Source-Drain Forward Servo Voltage l 5 15 25 mV ∆VGATE Gate Drive (VG – VS) IG = 0µA, –1µA; ∆VSD = 100mV l VDD – 0.2 VDD + 0.1 V IGATE(UP) Gate Pull-Up Current ∆VSD = 100mV, ∆VGATE = 5V l –3 –5 –8 mA IGATE(DN) Gate Pull-Down Current Strong Gate Pull-Down Current ∆VSD = –10mV, ∆VGATE = 5V ∆VSD = –100mV, ∆VGATE = 5V l l 7 1 10 2 13 3 mA A tOFF Gate Turn-Off Time in Fault Condition ∆VSD = 0.1V Step to –0.4V, CGATE = 3.3nF, ∆VGATE <1V l 220 ns ID DA, DB Leakage Current MOSFET Off MOSFET Open VD = 80V VD = –40V l l 10 –10 µA µA RD DA, DB Resistance ∆VSD = –50mV to 0.1V l 1 2 5 MΩ VBVD DA, DB Breakdown Voltage ID = 10mA, 6ms l 100 130 170 V IS SA, SB Leakage Current VS = 0V l ±2 μA ∆VSD(FLT) Source-Drain Fault Detection Threshold l 150 200 225 mV VFAULTB FAULTB Output Low IFAULTB = 5mA l 0.4 V IFAULTB FAULTB Leakage Current VFAULTB = 16V l ±1 μA Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All currents into pins are positive; all voltages are referenced to VSS unless otherwise specified. Note 3: An internal clamp limits the DA and DB pins to a minimum of 100V above VSS and –40V below VSS. This pin can be safely tied to higher voltages through a resistance that limits the current below 1mA DC or 10mA for a 6ms transient. Driving this pin with current beyond the clamp may damage the device. Note 4: Thermal resistance is specified with exposed pad soldered to a 3-inch by 4.5-inch, four layer FR4 board. If exposed pad is not soldered θJA = 93°C/W. |
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