STBR606/608

2/5

Symbol

Parameter

Min.

Typ.

Max.

Unit

Junction to case

7.4

8

°C/W

Junction to ambient

35

°C/W

THERMAL PARAMETERS

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

Forward voltage drop

1.05

V

Reverse leakage current per

leg

Tj = 25°C

5

µA

Tj = 125°C

50

µA

C

Junction capacitance per leg

(note 1)

55

pF

Note 1: Measured at 1MHz and applied reverse voltage of 4V.

ELECTRICAL CHARACTERISTICS

0

1

2

3

4

5

6

7

8

9

10

11

12

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

IF(av)(A)

IP / IF(av)=20

IP / IF(av)=10

IP / IF(av)=5

(capacitive load)

IP / IF(av)=P

(resistive load)

PF(av)(W)

Fig. 1: Average power dissipation of bridge versus

average output current.

0

1

2

3

4

5

6

7

0

25

50

75

100

125

150

Tamb(°C)

Rth(j-a)=Rth(j-c)

Rth(j-a)=15°C/W

Rth(j-a)=35°C/W

IF(av)(A)

Fig. 2: Average output current versus ambient

temperature (resistive load or inductive load)

0.1

1.0

10.0

100.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

tp(s)

Free air

Zth(j-a)(°C/W)

Fig. 3: Variation of thermal impedance junction to

ambient versus pulse duration (printed circuit

board epoxy FR4)

0.1

1.0

10.0

100.0

1000.0

0.0

0.5

1.0

1.5

2.0

2.5

VFM(V)

Tj=25°C

Tj=125°C

IFM(A)

Fig. 4: Forward voltage drop versus forward

current (typical values, per leg).