LTP5901-IPM datasheet(32/36 Pages) LINER

32 / 36 page

LTP5901-IPM/LTP5902-IPM

59012ipmfa

For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM

applicaTions inForMaTion

relaTeD DocuMenTaTion

TITLE

LOCATION

DESCRIPTION

SmartMesh IP Users Guide

http://www.linear.com/docs/41880

Theory of operation for SmartMesh IP networks and motes

SmartMesh IP Mote API Guide

http://www.linear.com/docs/41886

Definitions of the applications interface commands available over

the API UART

SmartMesh IP Mote CLI Guide

http://www.linear.com/docs/41885

Definitions of the command line interface commands available

over the CLI UART

LTP5901 and LTP5902 Hardware

Integration Guide

http://www.linear.com/docs/41877

Recommended practices for designing with the LTP5901 and

LTP5902

ETERNA2 User’s Guide

http://www.linear.com/docs/42916

The ETERNA2 module user’s guide includes certification

requirements applicable to certified geographies and support

documentation enabling customer certification in additional

geographies for the LTP5901 and LTP5902

SmartMesh IP Tools Guide

http://www.linear.com/docs/42453

The user’s guide for all IP related tools, and specifically the

definition for the On-chip Application Protocol (OAP)

This product has been specifically designed to utilize

RoHS-compliant materials and to eliminate or reduce the

use of restricted materials to comply with 2011/65/EU.

The RoHS-compliant design features include:

RoHS-compliant solder for solder joints

RoHS-compliant base metal alloys

RoHS-compliant precious metal plating

RoHS-compliant cable assemblies and connector

choices

RoHS-compliant and 245°C reflow compatible

Note: Customers may elect to use certain types of lead-

free solder alloys in accordance with the European Com-

munity directive 2011/65/EU. Depending on the type of

solder paste chosen, a corresponding process change to

optimize reflow temperatures may be required.

SOLDERING INFORMATION

The LTP5901 and LTP5902 are suitable for both eutectic

PbSn and RoHS-6 reflow. The maximum reflow solder-

ing temperature is 260°C. A more detailed description of

layoutrecommendations,assemblyproceduresanddesign

considerations is included in the LTP5901 and LTP5902

Hardware Integration Guide.

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