For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

4

HMC311LP3 / 311LP3E

v06.0617

InGaP HBT GAIN BLOCK

MMIC AMPLIFIER, DC - 6 GHz

Outline Drawing

Absolute Maximum Ratings

Collector Bias Voltage (Vcc)

+7V

RF Input Power (RFIN)(Vs = +5V)

+10 dBm

Junction Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 5.21 mW/°C above 85 °C)

0.339 W

Thermal Resistance

(junction to ground paddle)

192 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1A,

Passed 250V

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC311LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

311

XXXX

HMC311LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

311

XXXX

[1] Max peak relow temperature of 235 °C

[2] Max peak relow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS