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MP5455GL датащи(PDF) 3 Page - Monolithic Power Systems

номер детали MP5455GL
подробное описание детали  Peak Power Assist for Smart/AI-Enabled Speakers and Low-Power Applications
PDF  17 Pages
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производитель  MPS [Monolithic Power Systems]
домашняя страница  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP5455GL датащи(HTML) 3 Page - Monolithic Power Systems

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MP5455 – PEAK POWER ASSIST FOR LOW-POWER APPLICATIONS
MP5455 Rev. 1.01
www.MonolithicPower.com
3
2/2/2018
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2018 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage (VIN)................................... 8.0V
VSTRG ...............................................-0.3V to 35V
VSW....................................-0.3V to VSTRG + 0.3V
VBST ...................................-0.3V to VSTRG + 6.5V
VCST.................................................-0.3V to 40V
All other pins ..................................-0.3V to 6.5V
Continuous power dissipation (TA = +25°C)
(2)
................................................................... 2.6W
Junction temperature ................................150°C
Lead temperature .....................................260°C
Operating temperature............... -40°C to +85°C
Recommended Operating Conditions (3)
Supply voltage (VIN)..........................2.7V to 7V
Bus voltage (VB).................................2.7V to 6V
Storage voltage (VSTRG)..................... VIN to 30V
Operating junction temp. (TJ). .. -40°C to +125°C
Thermal Resistance (4)
θJA
θJC
QFN-20 (3mmx4mm).............. 48 ...... 10... °C/W
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum power dissipation is a function of the maximum
junction temperature TJ (MAX), the junction-to-ambient
thermal resistance θJA, and the ambient temperature TA. The
maximum continuous power dissipation at any ambient
temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA.
Exceeding the maximum allowable power dissipation
produces an excessive die temperature, causing the regulator
to go into thermal shutdown. Internal thermal shutdown
circuitry protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, which is 4-layer PCB.



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