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MP8124GD датащи(PDF) 19 Page - Monolithic Power Systems |
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MP8124GD датащи(HTML) 19 Page - Monolithic Power Systems |
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19 / 21 page ![]() MP8124 – 500mA, LNB POWER SUPPLY AND CONTROL REGULATOR MP8124 Rev. 1.0 www.MonolithicPower.com 19 11/11/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. PCB Layout Guidelines Efficient PCB layout is critical for high-frequency switching power supplies. A poor layout can result in reduced performance, excessive EMI, resistive loss, and system instability. For best results, refer to Figure 3 and follow the guidelines below. 1. Keep the boost output loop (IC-SW, D1, C2B, and IC-PGND) as small as possible. 2. Place the LDO input capacitor (C2A) and the output capacitor (C4) as close to VBOOST and VOUT as possible. 3. Connect the LDO output capacitor and the other signal ground to AGND. 4. Connect the boost output ground to PGND and then to AGND with a single point. 5. Keep all high-frequency AC current power traces (VDD, SW, PGND) as short and wide as possible. 6. Keep the TCAP voltage trace far away from any noise sources, such as the SW node. 7. Place a small decoupling capacitor as close to VDD as possible to reduce the input voltage ripple. 8. Place the bypass capacitor as close to BYPASS and VOUT as possible. 9. Keep the BST voltage path as short as possible. 10. Use a wide copper trace for GND to improve thermal performance. Vias on GND and copper around and under the MP8124 are also recommended to improve thermal performance. 1 2 2 1 2 1 2 1 1 2 2 1 2 1 1 2 2 1 2 1 1 2 1 2 1 2 2 1 1 2 1 2 1 2 2 1 VBOOST VOUT EXTM 13V/18V Figure 3: Layout Recommendation Design Example Table 1 is a design example following the application guidelines for the specifications below: Table 1: Design Example VIN 8V - 14V VOUT 13V/ 14V/ 18V/ 19V IOUT 0A ~ 0.5A The detailed application schematic is shown in Figure 4. The typical performance and circuit waveforms are shown in the Typical Performance Characteristics section. For more device applications, please refer to related evaluation board datasheet. |
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