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13

AMC Series

Thick Film Automotive Grade Chips

Wave soldering footprint

Reflow soldering footprint

di M en S ion S

(mm)

B

A

D

C

Preferred

direction

during

wave

soldering

Size

L

W

H

l1

l2

0201

0.60 ±0.03 0.30 ±0.03 0.23 ±0.03 0.12 ±0.05 0.15 ±0.05

0402

1.00 ±0.05 0.50 ±0.05 0.35 ±0.05 0.20 ±0.10 0.25 ±0.10

0603

1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15

0805

2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20

1206

3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20

1210

3.10 ±0.10 2.60 ±0.15 0.50 ±0.10 0.45 ±0.15 0.50 ±0.20

2010

5.00 ±0.10 2.50 ±0.15 0.55 ±0.10 0.45 ±0.15 0.50 ±0.20

2512

6.35 ±0.10 3.10 ±0.15 0.55 ±0.10 0.60 ±0.20 0.50 ±0.20

Size

A

B

C

D

0201 1.0 0.3 0.35

0.4

0402 1.5 0.5 0.5

0.6

0603 2.6 0.8 0.9

0.8

0805 3.0 1.2 0.9

1.2

1206 4.2 2 .2 1.0

1.5

1210 4.2 2.2 1.0

2.4

2010 6.1 3.3 1.4

2.4

2512 8.0 4.4 1.8

3.0

Size

A

B

C

D

0603 2.70 0.90 0.90 0.80

0805 3.30 1.30 1.00 1.30

1206 4.70 2.50 1.10 1.70

1210 4.70 2.50 1.10 2.50

2010 6.40 4.20 1.10 2.50

2512 8.20 5.50 1.35 3.20

Note: Wave soldering not rec-

ommended for parts smaller

than 0603.

perfor MA n C e d AtA

Test Method

Procedure

Requirements

Temp. Coeff.

of Res.

MIL-STD-202 Method

304

At +25/–55°C and +25/+125°C

High

Temperature

Exposure

AEC-Q200 Test 3

MIL-STD-202 Method

108

1,000 hours at TA = 155°C, unpowered

±(1.0%+0.05Ω) for D/F tol

±(2.0%+0.05Ω) for J tol

Moisture

Resistance

AEC-Q200 Test 6

MIL-STD-202 Method

106

Each temperature / humidity cycle is defined at 8 hours (method 106F),

3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a

& 7b, unpowered. Parts mounted on test-boards, without condensation

on parts

±(0.5%+0.05Ω) for D/F tol

±(2.0%+0.05Ω) for J tol

Biased

Humidity

AEC-Q200 Test 7

MIL-STD-202 Method

103

1,000 hours; 85°C / 85% RH 10% of operating power

Measurement at 24±4 hours after test conclusion.

±(1.0%+0.05Ω) for D/F tol

±(3.0%+0.05Ω) for J tol

Operational

Life

AEC-Q200 Test 8

MIL-STD-202 Method

108

1,000 hours at 125°C, derated voltage applied for 1.5 hours on, 0.5 hour

off, still-air required

±(1.0%+0.05Ω) for D/F tol

±(3.0%+0.05Ω) for J tol

Resistance

to Soldering

Heat

AEC-Q200 Test 15

MIL-STD-202 Method

210

Condition B, no pre-heat of samples

Lead-free solder, 260±5°C, 10±1 seconds immersion time

Procedure 2 for SMD: devices fluxed and cleaned with isopropanol

±(0.5%+0.05Ω) for D/F tol

±(1.0%+0.05Ω) for J tol

No visible damage

Thermal

Shock

AEC-Q200 Test 16

MIL-STD-202 Method

107

-55/+125°C

Number of cycles is 300. Devices mounted

Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air

±(0.5%+0.05Ω) for D/F tol

±(1.0%+0.05Ω) for J tol

ESD

AEC-Q200 Test 17

AEC-Q200-002

Human Body Model, 1 pos. + 1 neg. discharges. 0201: 500V;

0402/0603: 1KV; 0805 and above: 2KV

±(3.0%+0.05 Ω)

Solderability

Wetting

AEC-Q200 Test 18

J-STD-002

Electrical Test not required Magnification 50X. SMD conditions: (a)

Method B, aging 4 hours at 155°C dry heat, dipping at 235±3°C for

5±0.5 seconds. (b) Method B, steam aging 8 hours, dipping at 215±3°C

for 5±0.5 seconds. (c) Method D, steam aging 8 hours, dipping at

260±3°C for 7±0.5 seconds.

Well tinned (≥95% covered)

No visible damage

Board Flex

AEC-Q200 Test 21

AEC-Q200-005

Chips mounted on a 90mm glass epoxy resin PCB (FR4)

Bending for 0201/0402: 5 mm 0603/0805: 3 mm 1206 and above: 2 mm

Holding time: minimum 60 seconds

±(1.0%+0.05Ω)

Short Time

Overload

IEC60115-1 4.13

2.5 times of rated voltage or maximum overload voltage whichever is

less for 5 sec at room temperature

±(1.0%+0.05Ω) for D/F tol

±(2.0%+0.05Ω) for J tol

FOS

ASTM-B-809-95

Sulfur (saturated vapor) 500 hours, 60±2℃, unpowered

±(1.0%+0.05Ω)