MP2013 - 40V, 150mA, LOW QUIESCENT CURRENT LINEAR REGULATOR

3)

Connect

IN, OUT

and

especially GND

respectively to a large copper area to cool

the chip to improve thermal performance and

long-term reliability.

R1

R2

C3

C1

IN1

IN2

GND

FB

OUT

C2

MP2013

1

2

3

4

5

IN1

IN2

GND

FB

OUT

R1

R2

C2

C3

C1

GND

OUT

IN

OUT

IN

GND

IN1

OUT

IN2

FB

GND

NC

C1

C3

C2

R1

R2

4

5

6

1

2

3

OUT

IN

GND

NC

IN1

OUT

IN2

FB

6

7

8

1

2

3

4

5

NC

GND

NC

C1

C3

C2

R1

R2

Figure 5: PCB Layout (Top Layer)

DESIGN EXAMPLE

Below

is

a

design

example

following

the

application

guidelines

for

with

feedforward cap.

R1

R2

C3

C1

IN1

IN2

GND

FB

OUT

1uF

4.7uF

1.72M

Ω

1M

Ω

3.3V

C2

22nF

MP2013

Figure 6: Design Example

MP2013 Rev. 1.0

www.MonolithicPower.com

11

4/23/2014

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2014 MPS. All Rights Reserved.