MP200 – DYING GASP STORAGE AND RELEASE CONTROL IC

NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third

party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not

assume any legal responsibility for any said applications.

MP111 Rev. 1.01

www.MonolithicPower.com

13

4/25/2018

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2018 MPS. All Rights Reserved.

PACKAGE INFORMATION

SOIC-8

0.016(0.41)

0.050(1.27)

DETAIL "A"

0.010(0.25)

0.020(0.50)

SEE DETAIL "A"

0.0075(0.19)

0.0098(0.25)

0.150(3.80)

0.157(4.00)

PIN 1 ID

0.050(1.27)

BSC

0.013(0.33)

0.020(0.51)

SEATING PLANE

0.004(0.10)

0.010(0.25)

0.189(4.80)

0.197(5.00)

0.053(1.35)

0.069(1.75)

TOP VIEW

FRONT VIEW

0.228(5.80)

0.244(6.20)

SIDE VIEW

14

85

RECOMMENDED LAND PATTERN

0.213(5.40)

0.063(1.60)

0.050(1.27)

0.024(0.61)

NOTE:

1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN

BRACKET IS IN MILLIMETERS.

2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS.

3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH

OR PROTRUSIONS.

4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)

SHALL BE 0.004" INCHES MAX.

5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION AA.

6) DRAWING IS NOT TO SCALE.

0.010(0.25) BSC

GAUGE PLANE