SIT2002B datasheet(3/12 Pages) SITIME

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Rev. 1.0

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The Smart Timing Choice



The Smart Timing Choice



SiT2002B

High Frequency, Single Chip, One-output Clock Generator

Note:

4. Refer to JESD51 for

JA and JC definitions, and reference layout used to determine the JA and JC values in the above table.

Note:

5. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.

Table 3. Absolute Maximum Limits

Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part. Actual perfor-

mance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.

Parameter

Min.

Max.

Unit

Storage Temperature

-65

150

°C

Vdd

-0.5

Electrostatic Discharge

–

2000

Soldering Temperature (follow standard Pb free soldering guidelines)

–

260

°C

Junction Temperature[3]

–

150

°C

Note:

3. Exceeding this temperature for extended period of time may damage the device.

Table 4. Thermal Consideration[4]

Package

JA, 4 Layer Board

(°C/W)

JC, Bottom

(°C/W)

SOT23-5

421

175

Table 5. Maximum Operating Junction Temperature[5]

Max Operating Temperature

Maximum Operating Junction Temperature

70°C

80°C

85°C

95°C

Table 6. Environmental Compliance

Parameter

Condition/Test Method

Mechanical Shock

MIL-STD-883F, Method 2002

Mechanical Vibration

MIL-STD-883F, Method 2007

Temperature Cycle

JESD22, Method A104

Solderability

MIL-STD-883F, Method 2003

Moisture Sensitivity Level

MSL1 @ 260°C

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