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ZXTP56020FDBQ датащи(PDF) 2 Page - Diodes Incorporated |
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ZXTP56020FDBQ датащи(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() ZXTP56020FDBQ Datasheet number: DS38567 Rev.1 - 2 2 of 7 www.diodes.com April 2017 © Diodes Incorporated ZXTP56020FDBQ Absolute Maximum Ratings – Q1 & Q2 (@T A = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Collector-Base Voltage VCBO -20 V Collector-Emitter Voltage VCEO -20 V Emitter-Base Voltage VEBO -7 V Continuous Collector Current IC -2 A Peak Pulse Collector Current ICM -3 A Base Current IB -300 mA Peak Base Current IBM -1 A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Notes 6 & 8) PD 405 mW (Notes 6 & 9) 510 (Notes 7 & 8) 1650 (Notes 7 & 9) 2470 Thermal Resistance, Junction to Ambient (Notes 6 & 8) RJA 308 °C/W (Notes 6 & 9) 245 (Notes 7 & 8) 76 (Notes 7 & 9) 51 Thermal Resistance, Junction to Lead (Note 10) RJL 18 °C/W Operating and Storage Temperature Range — TJ, TSTG -55 to +150 °C ESD Ratings (Note 11) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge – Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge – Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the exposed collector pads on minimum recommended pad layout that is on a single-sided 1.6mm FR-4 PCB; device is measured under still air conditions whilst operating in a steady-state. 7. Same as note (6), except the device is mounted with the collector pad on 28mm x 28mm (8cm 2) 2oz copper. 8. For a dual device with one active die. 9. For dual device with 2 active die running at equal power. 10. Thermal resistance from junction to solder-point (on the exposed collector pads). 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115. |
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