MP8712GL datasheet(3/26 Pages) MPS

3 / 26 page

MP8712 – 18V, 12A, SYNCHRONOUS STEP-DOWN CONVERTER

MP8712 Rev.1.01

www.MonolithicPower.com

3/28/2017

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

VIN..................................................-0.3V to 19V

VSW................................ -0.6V (-7V for <10ns) to

VIN + 0.7V (25V for <25ns)

VBST ...................................................... VSW + 4V

VEN ............................................................... 18V

VOUT............................................................. 7V

All other pins .....................................-0.3V to 4V

Continuous power dissipation (TA = +25°C)

(2)

QFN-14 (3mmx4mm)................................. 2.5W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature.................. -65°C to 150°C

Recommended Operating Conditions (3)

Supply voltage (VIN).......................... 3V to 18V

Output voltage (VOUT) ...................0.6V to 5.5V

Operating junction temp. (TJ). .. -40°C to +125°C

Thermal Resistance

QFN-14 (3mmx4mm)

θJA

θJC

EV8712-L-00A ....................... 30........ 6.... °C/W

JESD51-7

(4).......................... 48....... 11... °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Highly effective thermal conductivity test board for leaded

surface-mount packages.

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