MP4559DN datasheet(2/19 Pages) MPS

2 / 19 page

MP4559 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER

MP4559 Rev. 1.01

www.MonolithicPower.com

12/23/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP4559DN*

SOIC8E

MP4559DN

LLLLLLLL

MPSYWW

MP4559DQ**

QFN10 (3X3mm)

ADDY

LLL

* For Tape & Reel, add suffix –Z (e.g. MP4559DN–Z)

For RoHS Compliant Packaging, add suffix –LF (e.g. MP4559DN–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP4559DQ–Z)

For RoHS Compliant Packaging, add suffix –LF (e.g. MP4559DQ–LF–Z)

PACKAGE REFERENCE

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

COMP

BST

VIN

FREQ

GND

TOP VIEW

EXPOSED PAD

QFN10

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +60V

Switch Voltage (VSW)............ –0.5V to VIN + 0.5V

BST to SW .....................................–0.3V to +5V

All Other Pins.................................–0.3V to +5V

Continuous Power Dissipation

(TA = +25°C)

(2)

SOIC8E……………………………………….2.5W

QFN10 (3X3mm)…………………………….2.5W

Junction Temperature...............................150

C

Lead Temperature ....................................260

C

Storage Temperature.............. –65°C to +150

C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................3.8V to 55V

Output Voltage VOUT.........................0.8V to 52V

Operating Junct. Temp (TJ)..... –40C to +125C

Thermal Resistance

(4)

θJA

θJC

SOIC8E...................................50 ...... 10 ...

C/W

QFN10 (3X3mm)………………50……12…

C/W

Notes:

1) Exceeding these ratings may damage the device

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

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