SFH 2302

2007-04-27

5

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch)

Empfohlenes Lötpaddesign Wellenlöten (TTW)

Recommended Solder Pad TTW Soldering

Maße in mm (inch) / Dimensions in mm (inch)

0.6 (0.024)

0.4 (0.016)

4.0 (0.157)

3.6 (0.142)

4.1 (0.161)

3.9 (0.154)

5.2 (0.205)

4.5 (0.177)

3.5 (0.138)

6.3 (0.248)

5.9 (0.232)

1.8 (0.071)

1.2 (0.047)

29 (1.142)

27 (1.063)

Chip position

Collector (Transistor)

Area not flat

GEOY6653

Cathode (Diode)

4 (0.157)

OHLPY985