TLE4998P8(D)

PG-TDSO-8 Package Outlines

Data Sheet

18

Revision 1.1, 2017-01

9

PG-TDSO-8 Package Outlines

Figure 9-1

PG-TDSO-8 (PG-TDSO-Plastic Green Thin Dual Small Outline), Package Dimensions

9.1

Distance Chip to package

Figure 9-2 shows the distance of the chip surface to the PG-TDSO-8 surface.

Figure 9-2

Distance of chip surface to package surface

9.2

Moisture Sensitivity Level (MSL)

The PG-TDSO-8 fulfills the MSL level 3 according to IPC/JEDEC J-STD-033B.1.

TLE4998x8D (dual die):

TLE4998x8 (single die ):