7.2 Tape and Reel Packaging

7.3 Soldering

7.3.1 Moisture Reflow Sensitivity

Clare has characterized the moisture reflow sensitivity

of LITELINK using IPC/JEDEC standard J-STD-020A.

Moisture uptake from atmospheric humidity occurs by

diffusion. During the solder reflow process, in which

the component is attached to the PCB, the whole body

of the component is exposed to high process tempera-

tures. The combination of moisture uptake and high

reflow soldering temperatures may lead to moisture

induced delamination and cracking of the component.

To prevent this, this component must be handled in

accordance with IPC/JEDEC standard J-STD-020A

per the labeled moisture sensitivity level (MSL), level

6.

7.3.2 Reflow Profile

The maximum ramp rates, dwell times, and tempera-

tures of the assembly reflow profile should not exceed

those specified in IPC/JEDEC standard J-STD-020A,

which were used to determine the moisture sensitivity

level of this component.

7.4 Washing

Clare does not recommend ultrasonic cleaning of

LITELINK.

Dimensions

mm

(inches)

330.2 DIA.

(13.00)

Top Cover

Tape Thickness

.102 MAX.

(.004)

12.090

(.476)

Embossed Carrier

Embossment

6.731 MAX.

(.265)

.406 MAX.

(.016)

Top Cover

Tape

3.20

(.126)

2.70

(.106)

7.493 ± .102

(.295 ± .004)

1.753 ± .102

(.069 ± .004)

2.007 ± .102

(.079 ± .004)

1.498 ±.102

(.059 ± .004)

3.987 ± .102

(.157 ±.004)

Feed Direction

11.989 ± .102

(.472 ± .004)

10.897 ± .025

(.429 ± .001)

1.549 ± .102

(.061 ± .004)

10.693 ± .025

(.421 ± .001)

16.002 ± .305

(.630 ± .012)

.050R TYP.

For additional information please visit www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set

forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its

products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into

the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a

person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC5620/CPC5621-R0.E

Copyright © 2002, Clare, Inc.

LITELINK™ is a trademark of Clare, Inc.

All rights reserved. Printed in USA.

5/14/2002