S29AS008J datasheet(3/56 Pages) CYPRESS

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Document Number: 002-00870 Rev.*K

Page 3 of 56

S29AS008J

Contents

Product Selector Guide ............................................... 4

Block Diagram.............................................................. 4

Connection Diagrams.................................................. 5

3.1

Standard TSOP.............................................................. 5

3.2

FBGA Connection Diagram ........................................... 6

3.3

Special Handling Instructions......................................... 6

Pin Configuration......................................................... 7

Logic Symbol ............................................................... 7

Ordering Information ................................................... 8

6.1

S29AS008J Standard Products ..................................... 8

Device Bus Operations................................................ 9

7.1

Word/Byte Configuration................................................ 9

7.2

Requirements for Reading Array Data........................... 9

7.3

Writing Commands/Command Sequences.................. 10

7.4

Program and Erase Operation Status.......................... 10

7.5

Standby Mode.............................................................. 10

7.6

Automatic Sleep Mode................................................. 10

7.7

RESET#: Hardware Reset Pin..................................... 11

7.8

Output Disable Mode ................................................... 11

7.9

Autoselect Mode .......................................................... 11

7.10 Sector Address Tables................................................. 13

7.11 Sector Group Protection/Unprotection ......................... 15

7.12 Temporary Sector Group Unprotect............................. 17

7.13 Write Protect (WP#) ..................................................... 17

7.14 Hardware Data Protection............................................ 18

Secured Silicon Sector Flash Memory Region ....... 18

8.1

Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory........................................ 19

8.2

Customer Lockable: Secured Silicon Sector NOT Pro-

grammed

or Protected at the Factory .......................................... 19

Common Flash Memory Interface (CFI) ................... 21

10.

Command Definitions................................................ 25

10.1 Reading Array Data ..................................................... 25

10.2 Reset Command .......................................................... 25

10.3 Autoselect Command Sequence ................................. 25

10.4 Enter Secured Silicon Sector/Exit Secured Silicon Sector

Command Sequence 26

10.5 Word/Byte Program Command Sequence................... 26

10.6 Unlock Bypass Command Sequence .......................... 26

10.7 Chip Erase Command Sequence ................................ 27

10.8 Sector Erase Command Sequence ............................. 28

10.9 Erase Suspend/Erase Resume Commands ................ 28

11.

Command Definitions................................................ 30

12.

Write Operation Status .............................................. 34

12.1 DQ7: Data# Polling ...................................................... 34

12.2 RY/BY#: Ready/Busy#................................................. 35

12.3 DQ6: Toggle Bit I ......................................................... 36

12.4 DQ2: Toggle Bit II ........................................................ 36

12.5 Reading Toggle Bits DQ6/DQ2.................................... 37

12.6 DQ5: Exceeded Timing Limits ...................................... 38

12.7 DQ3: Sector Erase Timer.............................................. 38

13.

Absolute Maximum Ratings....................................... 39

14.

Operating Ranges ....................................................... 39

15.

DC Characteristics...................................................... 40

15.1 CMOS Compatible ........................................................ 40

16.

Test Conditions ........................................................... 41

17.

Key to Switching Waveforms..................................... 41

18.

AC Characteristics...................................................... 42

18.1 Read Operations........................................................... 42

18.2 Hardware Reset (RESET#)........................................... 43

18.3 Word/Byte Configuration (BYTE#) ................................ 44

18.4 Erase/Program Operations ........................................... 45

18.5 Temporary Sector Group Unprotect.............................. 48

18.6 Alternate CE# Controlled Erase/Program Operations .. 49

19.

Erase and Programming Performance ..................... 51

20.

Package Pin Capacitance........................................... 51

21.

Physical Dimensions .................................................. 52

21.1 TS 048 - 48-Pin Standard TSOP .................................. 52

21.2 VBK048—48-Ball Fine-Pitch Ball Grid Array (FBGA)

8.15 mm x 6.15 mm ...................................................... 53

22.

Revision History.......................................................... 54

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